Passivated nano Cu powder, D50 20-200nm, sinters at 150-300°C or photonic flash to 3-6x bulk resistivity. Inkjet-stable distributions, custom passivation, R&D to production volumes.
QUICK ANSWER
Nano copper powder (20-200 nm, surface-passivated) is the feedstock for conductive inks that sinter at low temperature — inkjet-printed antennas, flexible hybrid electronics, photonic-sintered circuits, and chip-interconnect pastes. Its nanoscale sintering activity lets copper conductive films form at 150-300 °C or under millisecond light pulses, on substrates that cannot survive conventional firing.
Nanoparticles sinter at fractions of their bulk melting point — the surface-energy effect — so 50 nm copper particles fuse into conductive films at temperatures where polymer substrates survive. The product's entire engineering challenge is oxidation: nano copper oxidizes almost instantly in air, so particles ship passivated (organic shells, controlled oxide layers) or dispersed, and ink formulators design reducing sintering atmospheres or photonic sintering that sinters faster than oxygen can diffuse. Buyers are ink formulators and printed-electronics manufacturers specifying particle size and distribution (D50, span), passivation chemistry compatibility, and sintered resistivity data — typically 3-6x bulk copper for photonically sintered films.
MATERIAL DATA
Lot-level controls focus on the chemistry, particle characteristics, and process values that influence manufacturing consistency and finished-part performance.
| Element | Content | Performance Role |
|---|---|---|
| Copper (Cu) | > 99.5 wt% (metallic basis) | Conductive core metal |
| Particle size (D50) | 20-200 nm grade dependent | Sintering temperature and ink resolution |
| Passivation | Organic shell (PVP/amine type) | Oxidation protection — ink chemistry compatibility |
| Oxygen (O) | 1-5 wt% (nano grades) | Inevitable at nano scale — certified and minimized |
| Carbon | 1-3 wt% | Passivation residue, burns off in sintering |
Final limits can be aligned with the agreed purchase specification.
APPLICATIONS
Printed electronics manufacturing is the application universe: inkjet-printed RFID and NFC antennas, flexible sensor electrodes, printed heaters, touch-panel peripheral wiring, and PCB repair/3D electronics (aerosol and extrusion printing of circuit traces). The value proposition against silver ink is overwhelming on cost — copper ink at a tenth of silver's metal cost — and qualification momentum is strong wherever the process solves oxidation. Ink formulators buy on sintered conductivity per lot, jetting stability (particle size vs nozzle), and shelf life.
Advanced packaging and photonic sintering represent the frontier: copper nano pastes for die-attach and chip interconnect (pressure-less sintering joining dies to substrates), flash-lamp sintered copper films on paper and PET for roll-to-roll electronics, and laser-sintered direct-write circuits. These are R&D-to-early-production markets where powder buyers are technology developers — small quantities, deep technical collaboration, and specification evolution as their processes mature.
ELECTRONIC PASTE & CONDUCTIVE METAL POWDERS
CUSTOM SUPPLY
We supply nano copper in 20-200 nm D50 grades with PVP or amine passivation, dry powder or solvent dispersions, with certified size distribution (TEM/DLS), oxygen content, and sintered resistivity reference data. Custom passivation for your ink vehicle, photonic-sintering parameter guidance, and small R&D quantities with scale-up paths are standard. Ships without licensing or quota exposure.
We supply nano copper in 20-200 nm D50 grades with PVP or amine passivation, dry powder or solvent dispersions, with certified size distribution (TEM/DLS), oxygen content, and sintered resistivity reference data.
Custom passivation for your ink vehicle, photonic-sintering parameter guidance, and small R&D quantities with scale-up paths are standard.
Ships without licensing or quota exposure.
MATERIAL COMPARISON
| Comparison Point | This Product | Nano Silver |
|---|---|---|
| Metal cost per kg ink | ~1/10 of silver | Benchmark — expensive |
| Sintered conductivity | 3-6x bulk Cu | 2-4x bulk Ag — slightly better |
| Oxidation stability | Challenging — needs engineering | Stable — oxide conducts |
| Electromigration | Resistant | Prone — reliability concern |
| Market maturity | Fast-growing | Established |
| Best use | Cost-driven volume printing | Premium, reliability-critical |
TECHNICAL FAQ
Need a different chemistry, particle range, or processing route? Our material team can review the requirement and supply window.
Three proven routes: photonic/flash sintering (milliseconds — faster than oxidation), thermal sintering in nitrogen or forming gas, and chemical reduction during cure. We supply sintering parameter starting points per grade.
D50 below 100 nm with tight span and no oversize — nozzle diameters of 20-50 µm demand particles 100x smaller for stable jetting. Our 20-50 nm grade is the inkjet standard.
Six months sealed and cool for dry passivated powder; dispersions typically three to six months. Oxidation progresses slowly even passivated — buy to consumption and we support consignment stocking.
Yes — PVP suits polar solvents; amine and fatty-acid shells suit non-polar systems. Tell us your vehicle chemistry and we supply the compatible surface.
No. Nano copper powder ships without licensing; the product line is fully outside quota and control regimes.
RELATED PRODUCTS
Compare neighboring grades from the same material family, then review the complete category for additional chemistry and particle options.
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Share your target chemistry, particle size, process, annual volume, and destination. Our powder specialists will confirm the closest production grade and documentation package.
