
Conductive Copper Powder (Spherical & Flake, Paste Grade)
Paste-grade Cu powder 0.5-10µm spherical and 5-25µm flake, O < 0.3-0.5%, surface-treated, tap density > 4.5. Silver-free metallization for MLCC, LTCC, solar and printed electronics.
- Spherical cuts
- 0.5-1, 1-3, 3-5, 5-10 µm
- Flake grades
- 5-25 µm, aspect ratio 10-40:1




