Chemical Composition
TYPICAL| Element | Content | Performance Role |
|---|---|---|
| Copper (Cu) | Balance (86-93 wt%) | Conductive, ductile base matching copper tube metallurgy |
| Phosphorus (P) | 6.8-7.5 wt% (BCuP-2) | Melting depressant and self-fluxing agent on copper |
| Silver (Ag) | 0-15 wt% (grade dependent) | Improves flow, ductility, and gap-filling in premium grades |
| Tin (Sn) | 0-6 wt% (some grades) | Further lowers melting point and improves wetting |
| Others | < 0.15 wt% total | Impurity limits per AWS A5.8 |





