Chemical Composition
TYPICAL| Element | Content | Performance Role |
|---|---|---|
| Copper (Cu) | Balance (~76 wt%) | Ductile, conductive matrix cushioning the brazed grit |
| Tin (Sn) | 12-16 wt% | Lowers melting point and improves flow and wetting |
| Titanium (Ti) | 8-12 wt% | Active element — forms TiC on diamond and Ti-oxides on ceramics, creating the chemical bond |
| Silver (Ag) | 0-20 wt% (CuSnTiAg variants) | Improves ductility and lowers brazing temperature in premium grades |
| Others | < 0.5 wt% | Impurity control preserving titanium activity |





