Chemical Composition
TYPICAL| Element | Content | Performance Role |
|---|---|---|
| Tin (Sn) | > 99.9 wt% | Base purity for soldering and PM use |
| Oxygen (O) | < 0.3 wt% (fine grades) | Oxide skin control — affects sintering and reflow |
| Lead (Pb) | < 0.05 wt% | RoHS-compliant impurity limit |
| Iron + copper | < 0.05 wt% combined | Impurity panel per application |
| Other metals | < 0.03 wt% combined | Certified per lot |





